| Basic Function | |
|---|---|
| Cycle Time | 700ms / UPH=5k |
| Accuracy | ±10mil |
| Angle Accuracy | ±0.5° |
| Die Size | 4mil x 4 mil ~ 100mil x 100mil |
| Others Functions & Configuration | Missing Die Checking |
| Unlimited Program Saving | |
| Die Sorting Function | |
| Internal Vacuum Generator | |
| External UPS Support | |
| Post Bond Inspection System | Epoxy Drop Size Checking |
| Bonded Die Position Checking | |
| Die Rotation Checking | |
| Pre-Bond Die Orientation Checking | |
| Volume and Weight | |
|---|---|
| Volume(L x W x H) | 1260㎜ x 1380㎜ x 1480㎜ |
| Weight | 700㎏ |
| Basic Function | |
|---|---|
| Cycle Time | 65ms / UPH=55k |
| Accuracy | ±1mil |
| Positioning Accuracy | ±3° |
| Die Size | 3.5mil x 3.5 mil ~ 100mil x 100mil |
| Others Functions & Configuration | Missing Die Checking |
| Unlimited Program Saving | |
| LCD multi-Colored Monitor | |
| Built-in UPS support | |
| External Vacuum Generator | |
| Post Bond Inspection System | |
| Pre-Bond Die Orientation Checking | |
| Die Sorting Function | |
| Automatic Water Correction | |
| Automatic Change Wafer Rings System | |
| Volume and Weight | |
|---|---|
| Volume(L x W x H) | 950㎜ x 1600㎜ x 1500㎜ |
| Weight | 1050㎏ |
