Bonding System
Bonding System
  • DB810
  • Basic Function
    Cycle Time 700ms / UPH=5k
    Accuracy ±10mil
    Angle Accuracy ±0.5°
    Die Size 4mil x 4 mil ~ 100mil x 100mil
    Others Functions & Configuration Missing Die Checking
    Unlimited Program Saving
    Die Sorting Function
    Internal Vacuum Generator
    External UPS Support
    Post Bond Inspection System Epoxy Drop Size Checking
    Bonded Die Position Checking
    Die Rotation Checking
    Pre-Bond Die Orientation Checking
    Volume and Weight
    Volume(L x W x H) 1260㎜ x 1380㎜ x 1480㎜
    Weight 700㎏
  • DB8080
  • Basic Function
    Cycle Time 65ms / UPH=55k
    Accuracy ±1mil
    Positioning Accuracy ±3°
    Die Size 3.5mil x 3.5 mil ~ 100mil x 100mil
    Others Functions & Configuration Missing Die Checking
    Unlimited Program Saving
    LCD multi-Colored Monitor
    Built-in UPS support
    External Vacuum Generator
    Post Bond Inspection System
    Pre-Bond Die Orientation Checking
    Die Sorting Function
    Automatic Water Correction
    Automatic Change Wafer Rings System
    Volume and Weight
    Volume(L x W x H) 950㎜ x 1600㎜ x 1500㎜
    Weight 1050㎏
CEO Min Hyeong, Lee   Company Number 816-86-00239   607, ACE GASAN TOWER, 121, Digital-ro, Geumcheon-gu, Seoul, Korea
Phone +82-2-3016-2465   Fax +82-2-3016-2466
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